CMP Technology's EE Times and TechOnline Launch 'Under the Hood: Design Inspiration for the Creators of Technology'

The CMP Technology Electronics Group's EE Times and TechOnline today announced the launch of "Under the Hood," a print and online editorial program providing inspiration to electronics engineers around the world for today's high technology design challenges.

Under the Hood (UTH) will take some of today's hottest products and dive into the technologies, techniques, components and design decisions that were made to bring those designs to a successful close.

"It's no secret that designers are constantly juggling shrinking time-to- market windows and higher performance, more functionality in tighter form factors with lower power requirements -- at ever decreasing price points," said Patrick Mannion, editor of EE Times and editorial director for the project. "UTH will provide readers with examples of best practices for engineers on design challenges and tradeoffs faced throughout the industry."

Based on CMP's extensive market research, "teardowns" are recognized as one of the core pieces of technology information that is useful throughout the design process. UTH will showcase teardowns by experts as they tear into leading-edge devices and provide additional insights in solving these unique challenges.

Approximately 20 teardowns across four chapters will be addressed in the December 4, 2006 special issue. Sample topics by chapter include:

  -- Mobile: Mobile Phones, PDA, MP3 Player
  -- Digital Home: iPOD speakers, Plasma Displays, Digital CamCorder, iPOD
     Shuffle
  -- Computers: Laptops, Color Printers, Children's Computer, Optical Mice
  -- Semiconductors: TI vs. Intel on 90nm process, Samsung Flash Memory
     Designs, Chipcon (now part of TI) vs. Freescale ZigBee Wireless Chips

The ongoing program will kick-off December 4, 2006 with a special issue distributed via print and digital media throughout the U.S., Europe and Asia. Complementing the issue will be a special online resource from TechOnline (www.techonline.com/underthehood) which will be re-launched in mid-October. It will be comprised of a comprehensive archive of the 160+ teardowns EE Times has complied, along with a growing library of On Demand Seminar Series recorded by industry experts demonstrating teardowns through a user-friendly audio/PowerPoint platform.

Supporting sponsors of the project to date include Digi-key, National Semiconductor, Altera, Infineon, and Analog Devices, Inc. For more information about the program and sponsorship opportunities, please contact Steve Corrick, global sales director for CMP Media Electronics Group at scorrick@cmp.com or (415) 947-6651.

About the CMP Technology Electronics Group

The CMP Technology Electronics Group is the premier technology and business media brand serving the information needs of the creators of technology worldwide. Offering a full suite of products and services to reach electronics technology professionals throughout the world, the CMP Technology Electronics Group delivers the most targeted audience and actionable information to marketers in the electronics technology community. Each month, the CMP Technology Electronics Group delivers more than 1 million copies of its print publications, including EE Times, to subscribers in more than 23 countries and online visitors from 100 countries view more than 8 million pages on its Web sites in seven languages including EE Times Online and TechOnline. More than 40,000 decision makers attend its Embedded Systems Conferences each year in Boston, Silicon Valley, China and Taiwan.

About CMP Technology ( http://www.cmp.com/ )

CMP Technology is a marketing solutions company serving the technology industry. Through its market-leading portfolio of trusted information brands, CMP has earned the confidence of more technology professionals than any other media company. As a result, CMP is the premier provider of access, insight and actionable programs designed to connect sellers and buyers in ways that yield superior return on investment. CMP Technology is a subsidiary of United Business Media ( http://www.unitedbusinessmedia.com/ ), a global provider of news distribution and specialist information services with a market capitalization of more than $3 billion.

  Contact: Michelle Sabolich
  Atomic Public Relations for CMP Technology
  michelle.sabolich@atomicpr.com
  415-402-0230

SOURCE: CMP Technology

CONTACT: Michelle Sabolich of Atomic Public Relations, +1-415-402-0230,
or michelle.sabolich@atomicpr.com, for CMP Technology

Web site: http://www.unitedbusinessmedia.com/

Web site: http://www.cmp.com/