Industry Experts Address Key Technology Trends at International Digital Signal Processing Event

The producers of the eleventh annual International Conference on Signal Processing Applications and Technology (ICSPAT) today announced the keynote speaker and described a special panel discussion featuring experts on a key emerging technology market. The two special events continue the ICSPAT tradition of providing insights on both theory and applications of advanced digital signal processing technology.

ICSPAT combines poster sessions and a multi-day conference curriculum, running from October 16-19, 2000 at the Adam's Mark Hotel in Dallas, Texas, and brings together hundreds of DSP engineers and researchers from all over the world. Attendees are invited to both the keynote address, when Gerald McGuire of Analog Devices, Inc. will discuss the design challenges of multi-processing and multi-channel topologies, and the plenary panel discussion, which will focus on Voice-over-Packet applications.

In the keynote, which is presented at 5:15 - 6:00 p.m. on Wednesday, October 18, McGuire will discuss the design challenges of today's high performance applications, and the use of multi-processing and multi-channel topologies to increase performance, which he believes is a growing trend.

"Increasing demand for DSP performance leads design engineers and software developers to use every available MIP," said McGuire. "Large signal processing tasks that outstrip the performance of any single DSP still exist, and new tasks are always emerging. For small signal processing tasks that execute comfortably within a single chip, the channel density per DSP is the key performance criteria."

The Voice-over-Packet (V-o-P) panel discussion, on Wednesday, October 18 from 10:30 a.m. - 12:00 p.m., will be moderated by Krishna Yarlagadda, founder of Hellosoft Corporation. Panelists will include top executives from the companies that are pushing the edge of this technology. Bill Witowsky, senior vice president and chief technology officer, Telogy Networks, a Texas Instruments Company; Curtis Abott, president and chief executive officer, Malleable Technologies, a PMC-Sierra Company; Shahin Hedayat, president, Centillium Communications; and Shri Dodani, president and chief executive officer, VxTel Inc. are among the panelists to participate.

"This is the year of the Voice-over-Packet technology," said Yarlagadda. "It's the fastest growing market segment for DSP technology and will become an integral part of the changing communications infrastructure."

The panel will touch on the current trends in V-o-P. Topics of discussion will include efficient configurations, fixed function versus programmable architectures, and the future role of compression.

Additional events, during the ICSPAT conference's four-day program of tutorials, lectures, poster presentations, and free product training include two special guest lectures. Paul Marino, vice president and director of Motorola's DSP Core Technology Center, Semiconductor Products Group, will speak about the challenges of developing DSP technology to meet the demands of third generation (3G) wireless and multimedia applications, on Tuesday, October 17 at 11:00 a.m. On Thursday, October 19 at 11:00 a.m., Dr. Vincent Poor, professor of Electric Engineering at Princeton University, will discuss the revolutionary technology developments impacting future wireless communications.

In addition to full-day conference tutorials on Monday, October 16, sponsoring companies will also offer free educational sessions open to all attendees, and will host demonstration suites on Thursday, October 19. An Awards Ceremony honoring the conference's most outstanding presentations as selected by the ICSPAT Technical Review Committee takes place on Wednesday, October 18 from 5:00-5:15 p.m.

General Information

A catalog of information on the conference is available upon request, including a list of classes, special events, and registration and travel information. The catalog can be requested by calling 415-278-5231 or e-mailing jwatkins@cmp.com. More detailed information on ICSPAT 2000, including a complete listing of all of the conference papers, is available online at www.dspworld.com. Qualified journalists are invited to pre-register for the conference online at http://www.dspworld.com/icspat/press/ .

ICSPAT is produced by CMP Media, Inc. and is co-sponsored by EMBEDDED SYSTEMS PROGRAMMING and COMMUNICATION SYSTEMS DESIGN magazines, and ELECTRONIC ENGINEERING TIMES. Other conferences produced by CMP's Electronics tradeshow group include the Embedded Systems Conferences, the Embedded Executive Conference, HDI Expo and the PCB Design Conferences.

About CMP Media

CMP Media Inc. (http://www.cmpnet.com/) is a leading high-tech media company providing essential information and marketing services to the entire technology spectrum -- the builders, sellers, and users of technology worldwide. Capitalizing on its editorial strength, CMP is uniquely positioned to offer marketers comprehensive, integrated media solutions tailored to meet their individual needs. Its diverse products and services include newspapers, magazines, Internet products, research, direct marketing services, education and training, trade shows and conferences, custom publishing, testing and consulting.

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