Interop New York Unveils ARC Engagement Platform
Interop Features Premium Event Content on Multi Media Dynamic Web Site
Oct 3, 2012
SAN FRANCISCO, Oct. 3, 2012 /PRNewswire/ -- Interop New York, produced by UBM TechWeb, today unveils its ARC engagement platform where everyone can come and view premium conference content including videos, news, pictures, social media activity and select event content exclusively in one place. This year, Interop returns to New York with engaging and informative vendor-neutral content, top tier speakers and a large show floor where IT executives engage with the latest transformative technologies. Interop New York takes place at the Javits Convention Center, October 1-5, 2012. To visit the ARC platform visit http://www.multivu.com/players/English/58296-ubm-techweb-interop-2012/.
"The sheer amount of information Interop creates includes high level content about the latest IT innovations, breaking industry news, streaming video, a flood of photos and much more," said Jennifer Jessup, Interop General Manager. "With the Interop ARC, we're able to provide another engaging platform where our audiences can gather quality insights and perspectives generated from our event. This goes for our attendees who are joining us this week, to those who couldn't make it, and finally, as a reference to those who want to revisit content at a later date."
Interop is bringing together the industry's best to test the IT barometer and learn about the latest in critical IT matters. Interop New York will spotlight key technologies framing the IT conversation today including Software Defined Networking (SDN) and OpenFlow, Bring Your Own Device (BYOD), Mobile Device Management (MDM), Private / Hybrid Clouds, Server Virtualization, Big Data and Big Data Analytics, and Security.
The ARC spotlights Interop's conference program and keynote speakers including big names from Amazon, Cisco, Google, IBM and more. Additionally, the ARC features photos, the Interop TV channel, Interop social media channels, news, press releases and all facets of media emanating from the event.
Interop New York sponsors include Alcatel-Lucent, Amazon Web Services, AppDirect, CA Technologies, Cisco, DataStax, Eriksson, Fiberlink, HP, Huawei, IBM, Ixia, Opscode, OVCC, Rackspace, RedHat, Riverbed, SAP, Stoneware, Tier 3, Visage and WireSide.
Interop® delivers engaging experiences for IT professionals across the globe. Through in-depth education, community, news, real-world demonstrations and hands-on access to the latest technology, Interop serves as an unbiased source of learning and connection for IT pros, helping them drive business success and build for the future. The flagship event, Interop Las Vegas, is held each spring, with additional events in New York, Mumbai and Tokyo. Interop is a cornerstone in the UBM TechWeb family of global brands attracting tens of thousands of IT professionals each year. For more information visit, www.interop.com.
About UBM TechWeb
UBM TechWeb, the global leader in technology media and professional information, enables people and organizations to harness the transformative power of technology. Through its three core businesses – media solutions, marketing services and paid content – UBM TechWeb produces the most respected and consumed brands and media applications in the technology market. More than 14.5 million business and technology professionals (CIOs and IT managers, Web & Digital professionals, Software Developers, Government decision makers, and Telecom providers) actively engage in UBM TechWeb's communities and information resources monthly. UBM TechWeb brands include: global face-to-face events such as Interop, Black Hat and Enterprise Connect; award-winning online resources such as InformationWeek, Light Reading, and Network Computing; and market-leading magazines InformationWeek, Wall Street & Technology, and Advanced Trading. UBM TechWeb is a part of UBM plc, one of the world's largest media businesses as a global provider of news distribution and specialist information services with a market capitalization of more than $2.5 billion.
SOURCE UBM TechWeb
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