UBM Tech's EE Times and EDN Announce the Finalists of the 2013 ACE Awards Program

Awards Program to Take Place April 23, During DESIGN West

Mar 14, 2013

SAN FRANCISCO, March 14, 2013 /PRNewswire/ -- UBM Tech, which serves design engineers and the electronics industry with essential business and technical information, today announced the finalists for the 2013 ACE (Annual Creativity in Electronics) Awards.  The awards program honors the people and companies behind the technologies and products that are changing the world of electronics.   The awards ceremony where winners are announced will take place on Tuesday, April 23 at The Sainte Claire Hotel in San Jose, during DESIGN West, the annual technical conference and expo for electronics design engineers, entrepreneurs, and technology professionals who create products with electronic content.

(Logo: http://photos.prnewswire.com/prnh/20130314/SF77265LOGO)

"This year's finalists mark a shift in the industry, as the electronics industry becomes more focused on creating technologies attractive to consumers – from educational toys to tablet devices, smart phones and light sensors," said Alexander Wolfe, Brand Director, EE Times, UBM Tech. "We wish the finalists the best of luck in the competition."

"Product designers and developers have flexed their collective muscles toward meeting the needs of a rapidly evolving and highly connected world, and this year's crop of innovations – and innovators – underscore that flexion," said Patrick Mannion, Brand Director, EDN, UBM Tech. "The finalists represent the execution of forward-thinking technologies, tools and creativity that will enable the next generation of systems to meet applications ranging from mobile to automotive and medical. All illustrate the increasing influence that electronics and embedded design professionals have on today's culture."

Following are the 2013 ACE Awards finalists:


    • Advantest Corporation
    • ARM
    • Cadence Design Systems, Inc.
    • Maxim Integrated
    • Haruo Matsuno, President and CEO, Advantest Corporation
    • Lip-Bu Tan, President and CEO, Cadence Design Systems, Inc.
    • Ajit Manocha, CEO, GLOBALFOUNDRIES
    • Dr. Ted Tewksbury, CEO, Integrated Device Technology
    • Benedetto Vigna, Executive Vice President, General Manager of STMicroelectronics Analog, MEMS & Sensors Group
    • Altera Corporation, OpenCL Design Team
    • Maxim Integrated, MAX2173 Design Team
    • Nordic Semiconductor, Nordic Semiconductor nRF51822 Bluetooth low energy and 2.4GHz proprietary SoC development team
    • NXP Semiconductors, NXP TFA9887 Mobile Audio Design Team
    • SuVolta, Inc., SuVolta's DDC Transistor Technology Team
    • Dr. Mike Peng Li, Altera Fellow, Altera Corporation
    • John Horn, President, RAYCO Wireless
    • Steve LaJeunesse, Strategic Marketing Manager, Medical Equipment Segment, Maxim Integrated
    • Yogesh Ramadass, Electrical Design Engineer, Texas Instruments
    • Broadcom Corporation, Energy Efficient Ethernet (EEE)
    • Maxim Integrated, Zeus platform
    • Renesas Electronics America, RL78 microcontroller (MCU)
    • STMicroelectronics, FD-SOI
    • Xeralux, XLE Series Retrofit

          Analog ICs

    • Analog Devices Inc. - Analog Devices AD9670 octal ultrasound AFE with JESD204B Interface
    • Texas Instruments - ADS42JB69
    • Intersil - ISL37231
    • Maxim Integrated - MAX31865 RTD-to-Digital Converter
    • Integrated Device Technology - IDT 4M and 4E series of MEMS Oscillator

          Development Kits/Evaluation Boards

    • Texas Instruments - Bluetooth low energy SensorTag kit
    • Altera Corporation - Stratix V Advanced Systems Development Kit
    • Freescale Semiconductor - MPC8308 Networked Smart Gateway
    • STMicroelectronics - M24LR Discovery Kit
    • NXP Semiconductors - DALI and DMX512 Development Platforms for Wired Lighting Control Networks

          LEDs & Lighting

    • Philips LumiLeds - Luxeon Z LEDs
    • Cirrus Logic - CS1610/11
    • International Rectifier - IRS2980 LEDrivIR IC
    • Texas Instruments - TPS92550 and TPS92551 LED driver micro-modules
    • Power Integrations - LYTSwitch


    • Micron Technology - Hybrid Memory Cube
    • Altera Corporation - Cyclone V SoC
    • Marvell Semiconductor, Inc. - Marvell® DragonFly Platform
    • NXP Semiconductors - CBTL05024 high-performance, low-power switch for Thunderbolt interface
    • STMicroelectronics - Mystique

          Passives, Interconnects and Electromechanical

    • Vishay Intertechnology - LPS1100 Thick Film Resistor
    • FCI Electronics - VPRC Series Rectangular Plastic Connector
    • Tag-Connect, LLC - TC2030-CTX and TC2030-CTX-NL Tag-Connect Plug-of-Nails™ Cable for ARM Cortex
    • TE Connectivity - STRADA Whisper Backplane Connector
    • L-com Inc. - TRD695RA Right Angle Ethernet Cable

          Processors (FPGAs, MCUs, Microprocessors)

    • Xilinx, Inc. - Virtex-7 H580T FPGA/XC7VH580T
    • Freescale Semiconductor - QorIQ T4240 communications processor
    • Texas Instruments - TCI6636 Multicore Processors
    • Broadcom Corporation - 28nm XLP-200 Processor
    • STMicroelectronics - STM32 F3


    • Linear Technology - LTC6804
    • CUI Inc - NDM2Z Series Digital POL Module Family
    • International Rectifier - Third Generation CHiL Devices / IR35xx
    • Renesas Electronics America - RAA20770X Series of mini-POL converter
    • Texas Instruments - High Performance Isolated Power product line-UCD3138


    • AMS-TAOS USA, Inc. - AS3935 - Frankling Lightning Sensor
    • Linear Technology - SmartMesh® IP LTC5800-IPR
    • Sensor Platforms Inc - Sensor Platforms' FreeMotion™ Library
    • Microchip Technology Inc. - MGC3130 Electrical-Field-Based 3D Tracking and Gesture Controller, Featuring GestIC® Technology
    • STMicroelectronics - L3G4IS


    • Xilinx, Inc. - Vivado Design Suite
    • Apache Design, Inc. (subsidiary of ANSYS) - RedHawk-3DX
    • MathWorks - Simulink R2012b
    • Triad Semiconductor - ViaDesigner
    • Cadence Design Systems, Inc. - Cadence Incisive Debug Analyzer

          Test & Measurement Systems and Boards

    • Agilent Technologies - Infiniium 90000 Q-Series Oscilloscope
    • National Instruments - PXIe-5644R RF Vector Signal Transceiver
    • Cascade Microtech, Inc. - Power Device Production Test System APS200TESLA
    • Tektronix - BSA286C Bit Error Rate Tester
    • Teledyne LeCroy - LabMaster 10 Zi 65 GHz Oscilloscope


    • Broadcom - BCM4335 5G Wi-Fi Chip for Smartphones
    • Linear Technology - LTC5585 Wideband IQ Demodulator
    • Analog Devices Inc. - AD9914/15 Direct Digital Synthesizer
    • SkyCross - VersiTune-LTE Tunable Antenna Module
    • RFaxis, Inc. - RFX5000 Single-Chip/Single-Die 5GHz Wireless LAN RF Front-End IC in Pure CMOS

A panel of EE Times and EDN editors as well as independent judges, including William Tai
, General Partner, 
Charles River Ventures; Erach Desai
, Financial Advisor, 
Merrill Lynch Wealth Management; Gene Frantz
, Professor, 
Rice University; Nick Tredennick, 
Gilder Technology Report; Gordon Bell
, Senior Researcher, 
Microsoft Research; John Mashey
, Consultant, 
TechViser; Dennis Monticelli, Chief Technologist and Fellow, 
Texas Instruments; Lucio Lanza,
 Managing Director, 
LanzaTech Ventures; George M. Scalise, 
, Semiconductor Industry Association; chose the finalists and winners. Judging took place from February 25, 2013 – March 8, 2013.

A panel of EE Times and EDN editors also selected winners in additional categories, which include Jim Williams Contributor of the Year, sponsored by Linear Technology, and the Lifetime Achievement Award.  IEEE, through their own judging process, will announce the winners for IEEE Spectrum Technology in the Service of Society and IEEE Spectrum Emerging Technology Award at the awards ceremony in April.

All winners will be announced at the ACE Awards on Tuesday, April 23 at The Sainte Claire Hotel in San Jose, during DESIGN West. To purchase tickets to attend the ACE Awards, go to: http://ubm-ace.com/tickets.php. Tickets are $185.00 per person.

For more information on the awards program visit http://ubm-ace.com/.

The EE Times and EDN ACE Awards are generously sponsored by Executive Platinum sponsor Avnet Electronics Marketing, Category sponsor Linear Technology and Association media sponsor IEEE Spectrum.

About UBM Tech
UBM Tech is a global media business that provides information, events, training, data services, and marketing solutions for the technology industry.  Its media brands and information services inform and inspire decision makers across the entire technology market— engineers and design professionals, software and game developers, solutions providers and integrators, networking and communications executives, and business technology professionals.  UBM Tech's industry-leading media brands include EE Times, Interop, Black Hat, InformationWeek, Game Developer Conference, CRN, and DesignCon. The company's information products include research, education, training, and data services that accelerate decision making for technology buyers.  UBM Tech also offers a full range of marketing services based on its content and technology market expertise, including custom events, content marketing solutions, community development and demand generation programs. UBM Tech is a part of UBM (UBM.L), a global provider of media and information services with a market capitalization of more than $2.5 billion.

Available Topic Expert(s): For information on the listed expert(s), click appropriate link.
Alexander Wolfe

Patrick Mannion

For more information on UBM Tech please contact:
Felicia Hamerman, Vice President, Marketing, Electronics
T: 516.562.5652, E: felicia.hamerman@ubm.com