DesignCon 2018 Announces Full Conference Schedule, New Boot Camp Seminars, Opportunity to Earn IEEE Accreditation

Event Brings Together the Electronic Design Industry for Education, Networking and Career Development

Nov 9, 2017

SANTA MONICA, Calif., Nov. 9, 2017 /PRNewswire/ -- DesignCon 2018, the nation's premier conference for chip, board and systems design engineers, today announced its full conference agenda featuring over 100 technical sessions spanning the latest developments in hardware and high-speed communications design, full-day boot camp seminars designed to give attendees working knowledge on critical industry topics and the addition of IEEE accreditation opportunities. The three-day conference covers all aspects of electronic design and is curated by the Technical Program Committee (TPC), which is comprised of over 90 electronic design experts from organizations including IBM, Raytheon and Samsung. DesignCon 2018 takes place January 30 - February 1, 2018, at the Santa Clara Convention Center in Santa Clara, CA. To apply for a media pass, please click here.

DesignCon 2018 Announces Full Conference Schedule,
New Boot Camp Seminars, Opportunity to Earn IEEE Accreditation

"As our longtime attendees can attest, DesignCon is a community-driven event—everything from our conference sessions to our deep-dive boot camps to our networking opportunities are created with the needs of today's electrical engineer in mind," said Nina Brown, vice president of events, UBM. "This year's conference is no different. We're very fortunate to have the insight of over 90 brilliant electronic design experts shaping the content of DesignCon 2018, and I'm confident that both new and returning attendees will find this year's programming highly compelling."

The 2018 agenda features 14 conference tracks covering system co-design, optimizing high-speed serial design, applying test and measurement methodology, modeling and analysis of interconnects and more. In total, attendees will have access to over 100 technical sessions led by experts from the likes of Cisco, Intel, Oracle and Qualcomm. Sample technical sessions include:

Complementing the technical sessions are three full-day boot camps, which take deep dives into core introductory principles on electronic design and engineering. The boot camps, taking place from 9:00 AM- 4:30 PM on Tuesday, January 30, can be utilized as crash courses into notable industry topics such as  high-speed serial design, pragmatic signal integrity and test & measurement techniques.

Additionally, for the first time, DesignCon 2018 will offer continuing education units from the Institute of Electrical and Electronics Engineers (IEEE) for all sessions attended, giving attendees the opportunity to work toward an official IEEE certificate. IEEE accreditation helps professionals stand out to employers, maintain engineering licenses and meet training requirements.

Register for DesignCon 2018:

To register for the event please visit: designcon.tech.ubm.com

To apply for a media pass please visit: designcon.tech.ubm.com/2018/index/registrations/media

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About DesignCon
DesignCon is the world's premier conference for chip, board and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board and systems designers in the country.  This three-day technical conference and two-day expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: www.designcon.com. DesignCon is organized by UBM plc. UBM is the largest pure-play B2B Events organizer in the world. Our 3,750+ people, based in more than 20 countries, serve more than 50 different sectors. Our deep knowledge and passion for these sectors allow us to create valuable experiences which enable our customers to succeed. Please visit www.ubm.com for the latest news and information about UBM. 

 

SOURCE DesignCon

For further information: Richard Trunzo, designconpr@ubm.com


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